蓝牙模块应用-深圳市丰禾原电子科技有限公司

语言

English 日語

语言

English 日語

0755-28016180

首页 > 产品与技术应用 > 高通芯片方案 > 蓝牙模块应用

产品与技术应用

BM527

About Us

Company Profile

Core Capabilities

Key Technologies

Partners

Supplier Portal
Products & Technology application

Qualcomm chip solution
Bestechnic chip solution
Airoha chip solution
MediaTek Chip solution
Microchip Semiconductor
News

Company news
Industry News
Contact us

If you have any question.please contact us at manager@sunitec-cn.com

Building C, Weixiangtai Industrial Park, No. 725, Dasan Village, Xingfu Community, Fucheng Street, Longhua District, Shenzhen

+86-755-28016180
Follow us

Copyright © Sunitec Electronic Technology Limited Guangdong ICP No. 2021154097

Website Design By SZTD